1. 2. 3. material content data sheet sales product name idp08e65d1 issued 29. august 2013 ma# MA001015612 package pg-to220-2-1 weight* 1963.13 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.330 0.02 0.02 168 168 leadframe non noble metal iron 7439-89-6 0.753 0.04 383 inorganic material phosphorus 7723-14-0 0.226 0.01 115 non noble metal copper 7440-50-8 751.797 38.29 38.34 382959 383458 wire non noble metal aluminium 7429-90-5 1.247 0.06 0.06 635 635 encapsulation organic material carbon black 1333-86-4 6.035 0.31 3074 plastics epoxy resin - 114.656 5.84 58405 inorganic material silicondioxide 60676-86-0 482.762 24.59 30.74 245914 307393 leadfinish non noble metal tin 7440-31-5 14.487 0.74 0.74 7379 7379 plating non noble metal nickel 7440-02-0 0.198 0.01 101 inorganic material phosphorus 7723-14-0 0.000 0.00 0.01 1 101 solder non noble metal antimony 7440-36-0 0.041 0.00 21 noble metal silver 7440-22-4 0.101 0.01 52 non noble metal tin 7440-31-5 0.263 0.01 0.02 134 207 heatspreader non noble metal iron 7439-89-6 0.590 0.03 301 inorganic material phosphorus 7723-14-0 0.177 0.01 90 non noble metal copper 7440-50-8 589.466 30.03 30.07 300268 300659 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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